OC3D Review: Battle of the Goooop!
- Thread starter JN
- Start date
Great review and great pictures. That second picture on Liquid Pro - is that how it looks when it's spread? It looks very lumpy and uneven, but it could be just the picture due to different shades of metal.
It's just amazing to see that heat conductivity of Liquid Pro is so much better than the rest. This is like getting a $50 heatsink to replace the stock hsf.
It's just amazing to see that heat conductivity of Liquid Pro is so much better than the rest. This is like getting a $50 heatsink to replace the stock hsf.
FragTek
New member
Great review! I think there should have been some mention in the review about AS5 needing a proper amount of time to cure and perform at it's peak however. The cured results may have been a bit closer to the liquid coollabs compound.
I will definately be trying out the liquid metal compound on my next build though, for sure. Heck I should test it out on the MBP.
I will definately be trying out the liquid metal compound on my next build though, for sure. Heck I should test it out on the MBP.
Techdomain.com.au
New member
just some questions (I actually joined up for this one!)
what was the ambient temp, and how closely was the ambient and case temp controlled? Obviously the ambient temp has a massive bearing on a test like this! I would imagine that without a fairly strong climate control you would have some variance in temp over the week or more that it took you to record the results.
Finally, as a comment, thermal pastes set at a different rate, and as a minimum I would suggest that you would need at least 72 hours, for the shin-etsu in particular. The thicker the compound, the longer the set time seems to be, and I wonder if that might make a difference in testing, particularly when you are comparing a thin liquid like the coollaboratory to a thick one like the others.
And also while I am at it, did you by any chance try some of the white generic ones? I would be interested to know how they perform!
what was the ambient temp, and how closely was the ambient and case temp controlled? Obviously the ambient temp has a massive bearing on a test like this! I would imagine that without a fairly strong climate control you would have some variance in temp over the week or more that it took you to record the results.
Finally, as a comment, thermal pastes set at a different rate, and as a minimum I would suggest that you would need at least 72 hours, for the shin-etsu in particular. The thicker the compound, the longer the set time seems to be, and I wonder if that might make a difference in testing, particularly when you are comparing a thin liquid like the coollaboratory to a thick one like the others.
And also while I am at it, did you by any chance try some of the white generic ones? I would be interested to know how they perform!
KiTchMe said:
The second picture of the CLP was actually partially spreaded over the surface so you could see the difference between the IHS colour and the compound colour.
CLP is quite a strange substance, as you spread it parts of it change colour. Some of it looks tarnished, while other parts remain bright silver. This is what gives it the bumpy appearance.
Techdomain.com.au said:
Ambient temperature was 26oc on each occasion being set by the thermostat here and measured with thermometer. All tests were performed late evening so that temperature was much more controllable.
The tests were not performed inside a case so case temperature had no bearing.
I'm afraid i didn't test any generic goop as that was beyond the scope of the review requested by the retailer.
maybe outside their scope, but certainly interesting for everybody else
good work on the review nonetheless, although I wouldn't switch thermal compound for the small difference in CPU temperature you get. If your CPU has to be ~5°C cooler in order to work correctly, something else is wrong
good work on the review nonetheless, although I wouldn't switch thermal compound for the small difference in CPU temperature you get. If your CPU has to be ~5°C cooler in order to work correctly, something else is wrong
XMS said:
Yeah, I assumed that my eyes were playing tricks on me with that picture. Since your review, I found a bit more info on this magical 'liquid' and I'm just amazed of its thermal/heat conductive properties. I just ordered Freezer64 Pro and would love to try CLP with it. I wonder if the temp difference would even be that great with air-cooled setup (compared to your test done in water-cooled environment).
Edit: I just read your post that the test was performed outside the case. It answered some of the questions I wanted to ask...
jmke said:maybe outside their scope, but certainly interesting for everybody else
good work on the review nonetheless, although I wouldn't switch thermal compound for the small difference in CPU temperature you get. If your CPU has to be ~5°C cooler in order to work correctly, something else is wrong
For an overclocker 5*C can be the difference between stability and a nice big system failure and depending on the cpu, 5*C could allow for another few MHz
