As the title says I've delidded my 4770K. CLU was still in the mail so I used AS Ceramique 2. Temps droped about 10 degrees Celsius and then CLU arrived. Took everything appart, cleaned with isopropanol and applied a really thin layer of CLU between die and IHS. Temperatures increased and to cut a long story short I believe there is too much clearance between die and IHS.When I took it appart again, i made sure to pick the IHS up so I could see how CLU had spread on it. Its looked like they barely touched. So now I'm thinking of lapping the IHS to the surface it comes in contact with the PCB. Before doing that, I would like some input as to what I might have done wrong.Thanks in advance.