Question with different opinions.

[Youngie1337]

Right.

Q. What is the best way to apply thermal paste, and how much of it.

My theory, about pea sized and spread edge to edge once, and then skim over the paste to even it out.

What is the best method for best results?

Soo many different opinions!

 

[AdrianD2]

I've researched quite a bit before a while ago, and if I remember correctly two thin lines forming an X gets the best coverage.

Correct me if I'm wrong, I definitely have nowhere near the amount of experience people have on here like Mayhem, he could definitely give you an answer.

 

[FragTek]

Is this for a HDP cooler or standard flat-based HSF?

If an HDP type cooler 2 x ~1.5cm lines in between the heatpipes out from the center most heatpipe (put none on the CPU). Also pack the air gaps on the HSF with compound as well.

If flat base, rice grain right in the middle of the IHS is the best method. Less is more, a tiny drop goes way way way further than most people are willing to accept and use entirely too much.

Spreading is only an appropriate method for installing a heatsink directly on to a CPU/GPU die with no IHS.

 

[S_I_N]

I've done it all in my years of building rigs and I cant say any one way is better than the other as far as temps go. I can say however that the spread method (which I do most of the time) uses more than is needed and clean up post hsf removal is more demanding as it does squish out from under the base. my current application is grain method as I had just enough NH-1 left to try with my Rasa wb I'll be tinkiering inside rig later and reapplying my ceramique to see if there is any change in temps between the 2 for water cooling.

and as said if its a DCU type of base (not flat due to heat pipes) then you want to apply TIM to both cpu and base. When doing the base whats important is to apply it making sure the crevices are filled then scrape away excess with a plastic card or something with a straight edge that wont dislodge it from cracks. you dont need much if any left on the rst of base. then do whatever method you choose for the cpu.

 

[yassarikhan786]

For the sandybridge CPU's I think a dot in the middle or a thin line is the best option. I saw an Image showing the die and it is a rectangular shaped, so I think the thin line method might be best. The thin line might just be for Artic Silver 5, I am not completely sure.

 

[sheroo]

Have a look at this thread pictures are pretty self explanatory:-

http://benchmarkreviews.com/index.php?option=com_content&task=view&id=170&Itemid=1&limit=1&limitstart=4