AMD plans to tape out 7nm products by the end of 2017

[WYP]

AMD has revealed their plans to tape out 7nm products by the end of 2017, which means that Zen 2 and Navi could launch earlier than expected.



Read more on AMD's planned 7nm design tape outs.

 

[AlienALX]

Same time next year that Ryzen launched this year would be kewl.

 

[AngryGoldfish]

Even this time next year would be nice... or... kewl.

 

[NeverBackDown]

Makes you wonder what the fuss about 14nm+ is all about then

 

[Dicehunter]

Same time next year that Ryzen launched this year would be kewl.

Indeed, And as it's going to be on the AM4 socket, All being well, It will just be a simple drop in for current AM4 mobo owners

 

[g0ggles1994]

Makes you wonder what the fuss about 14nm+ is all about then

I would personally guess it won't be a refresh but a different stepping to the current Zen CPUs giving better clocks and wattage, kinda like the Phenom II X4 955 C2 and C3.

 

[NeverBackDown]

I would personally guess it won't be a refresh but a different stepping to the current Zen CPUs giving better clocks and wattage, kinda like the Phenom II X4 955 C2 and C3.

It could be for the APUs too. Since they are coming out later this year, a 14nm+ process isn't far stretched to assume.

 

[HJ1mech]

So noob question. What exactly does "tape out" mean in the design/build process?

 

[NeverBackDown]

So noob question. What exactly does "tape out" mean in the design/build process?

In electronics design, tape-out or tapeout is the final result of the design process for integrated circuits or printed circuit boards before they are sent for manufacture. The tape-out is specifically the point at which the graphic for the photomask of the circuit is sent to the fabrication facility.

This is the definition I see most.

 

[HJ1mech]

In electronics design, tape-out or tapeout is the final result of the design process for integrated circuits or printed circuit boards before they are sent for manufacture. The tape-out is specifically the point at which the graphic for the photomask of the circuit is sent to the fabrication facility.

This is the definition I see most.

Thank you very much for the answer I appreciate it.

 

[NeverBackDown]

Thank you very much for the answer I appreciate it.

No problem!
It essentially means is that the Design is done, and is being sent over to the Fabrication labs to be made into prototypes and etc.

 

[Sliced]

Makes you wonder what the fuss about 14nm+ is all about then

14nm+ will be just like 14nm.

The only real difference is the CPU's will be "stronger" and more efficient.
So they should require less power to run,
Run cooler,
Overclock better,
The SOC's within them should be able to handle more (so better APU if applied, higher RAM...)

There are a few more differences but not worth talking about.
The main difference for AMD would be, it should be cheaper to make, and better yields so more profit.

This is all true on paper, but doesn't mean it has to happen.
So you could have a "golden" chip which out performs 14nm+.

 

[AngryGoldfish]

14nm+ will be just like 14nm.

The only real difference is the CPU's will be "stronger" and more efficient.
So they should require less power to run,
Run cooler,
Overclock better,
The SOC's within them should be able to handle more (so better APU if applied, higher RAM...)

There are a few more differences but not worth talking about.
The main difference for AMD would be, it should be cheaper to make, and better yields so more profit.

This is all true on paper, but doesn't mean it has to happen.
So you could have a "golden" chip which out performs 14nm+.

That's a given. I think he was more referring to the specifics regarding how the improved process will be an improvement, not just whether it will be an improvement or in what area.

 

[Radioman]

In electronics design, tape-out or tapeout is the final result of the design process for integrated circuits or printed circuit boards before they are sent for manufacture. The tape-out is specifically the point at which the graphic for the photomask of the circuit is sent to the fabrication facility.

This is the definition I see most.

The thing of it is photographic imaging went out 15 years ago. They image straight to plate. Anyone with an acquaintance of PCB Design CAD programs knows the finished files, including excelon drill files, are sent straight to the PCB Manufacturing House. Prototype boards are done on XY Plotters equipped with drills.

 

[NeverBackDown]

That's a given. I think he was more referring to the specifics regarding how the improved process will be an improvement, not just whether it will be an improvement or in what area.

Yep^^^

The thing of it is photographic imaging went out 15 years ago. They image straight to plate. Anyone with an acquaintance of PCB Design CAD programs knows the finished files, including excelon drill files, are sent straight to the PCB Manufacturing House. Prototype boards are down on XY Plotters equipped with drills.

Why must you always try to correct me and then proceed to act like you know more? Getting pretty old. All I did was copy and paste a definition from Google to inform another person about a term they did not know.