Ghosthud1
New member
I have been coming across alot of posts and articles rumouring that the heat issues surrouding ivy bridge is down to some decisions that intel have made.
Basically the heat issues are rumoured to be a problem associated with intels way of attaching the IHS to the CPU cores, or its down to ivy bridges power density which tom explained clearly in his review, it could be a mixture of the two.
Speculation has rumoured that retail CPU's will feature the use of the fluxless solder and will be alot cooler than there engineering sample counter parts.
http://www.youtube.com/watch?v=lMzzUuvKWPM
A video of a guy butchering a 3570k which is apparently already dead, you can clearly see intel have opted for TIM instead of fluxless solder, the 3570k in the video is an engineering sample.
Tell me what you guys think, i just dont know to think now
Basically the heat issues are rumoured to be a problem associated with intels way of attaching the IHS to the CPU cores, or its down to ivy bridges power density which tom explained clearly in his review, it could be a mixture of the two.
[font=arial,helvetica,sans-serif]So why is Ivy Bridge hot?[/font]
[font=arial,helvetica,sans-serif]Intel is using TIM paste between the Integrated Heat Spreader (IHS) and the CPU die on Ivy Bridge chips, instead of fluxless solder.[/font]
Speculation has rumoured that retail CPU's will feature the use of the fluxless solder and will be alot cooler than there engineering sample counter parts.
http://www.youtube.com/watch?v=lMzzUuvKWPM
A video of a guy butchering a 3570k which is apparently already dead, you can clearly see intel have opted for TIM instead of fluxless solder, the 3570k in the video is an engineering sample.
Tell me what you guys think, i just dont know to think now
