In case air flow

[Filekutter]

This is something I've been pondering a while now, ever since seeing an article on it somewhere... pls don't ask. Course, if you really want I could try to find it.

Anyway, the argument was that, incorrect fan placement could result in the air's "route" through the case causing voids, or areas where the air would in effect not be moving or even in a circular motion; instead of being part of a direct "flow" out the back of the case. I've been pondering this a while, and decided to see what kinds of responses ya'll would have.

This has even led me to ponder the use of top exhaust fans alongside rear fans. Yes, the possibilities are endless for proposals to what "could" actually occur. Myself I"m thinking more along the lines of the old maxim of "the shortest distance between two points is a straight line". Which of course would make me more likely to use 2 or 3 fans in front, and same in rear without any other fans at all.

Okay, your turn.

 

[S_I_N]

yes voids can be caused by setting up fans in different manners. Most do front, side and bottom intake and rear top exhaust. This setup should all but eliminate any dead spots. I myself use front and side intake with a single rear exhaust, with my el-cheapo rocketfish 92mm universal heatsink, my temps on the cpu show anywhere from 25-28 idle (depending on ambient temps) and never above 40 stressing. This is running a 3.5GHz oc on an AMD Phenom II X4 925 pushing 1.35volts (all I can get out of my DDR3 1333MHz again el-cheapo stuff lol. I think the theory is that having the side intakes kind of disrupts the front to back flow helping to eliminate dead spots by inputting airflow from a different direction. now if ya filled the front of case with intakes and the rear with exhausts the same would hold true (no dead spots) as it would push straight thru. This would hold true if the fans are running at the same cfm ratings. Hope this helps

 

[Stryker64]

Voids where air stops moving, or deadzones typically occur in a positive air pressure environment (more air going in than out), for certain cases like the Antec Lanboy, with it's body being completely made out of mesh, this really isn't an issue, but for a case where they have solid sides, the air will all try to escape through any gaps it can find, but mainly through the rear exhaust, but due to physics it's unable to do so.

Deadzones typically occur in corners of the case where there aren't any fans, but it also depends on the the layout of the components inside the case.

 

[Tortuga]

Voids where air stops moving, or deadzones typically occur in a positive air pressure environment (more air going in than out), for certain cases like the Antec Lanboy, with it's body being completely made out of mesh, this really isn't an issue, but for a case where they have solid sides, the air will all try to escape through any gaps it can find, but mainly through the rear exhaust, but due to physics it's unable to do so.

Deadzones typically occur in corners of the case where there aren't any fans, but it also depends on the the layout of the components inside the case.

Yeah I think the Lanboy was designed for a positive pressure inside the case, then the mesh allows for exhaust everywhere. Interesting looking too.

 

[Filekutter]

Wow, thank you muchly for the info. Back to pondering. Right now I have the ExtremeEngine ET which is a dustmonster from heck, but also a huge sidefan. Course, right now the economics make it impossible to do anything but dream. I do know any future case will need to have dust covers for all intakes or at least have them available from the OEM.