Basic cooling as shown in the beginning will work. It's generally about 101% correct.
That kind of great cooling is generally impossible with most cases that can be purchased today. Case manufacturers will offer pretty (what they want us to believe is pretty), lot's of front panel plugins (to help block proper airflow), and slick lookin' front panels (to insure we block any real airflow) at an inflated price so we can all be cool.
Problem is, we're cool and our components are anything but cool.
Nothing wrong with a side panel fan blowing in if it really helps. If that fan just serves to give a false reading because it blows cool air on a sensor...we lose.
If that side panel fan disrupts proper airflow thru the case...we lose.
The Intel solution of a duct blowing directly on the hsf is a pretty good idea...much better that just tossing air at whatever.
Other solutions like the badong stuff kind of work; Sidney Wong's Chill Vent ducting does work; our homegrown solutions might work.
Good basic cooling as shown in first post of this thread always works...always.
Everything out here that we can consider a cooling solution depends on good basic airflow thru a case. Water, phase change, hsf...it all depends on air flowing over the top to carry heat away.
Consider what a friend once told me. We can have cool, we can have cheap, and we can have quiet. Problem is; we can only have two out of three.
Chips and chipsets are getting better. We will enjoy lower temps and power requirements in the future. The P4E made a bunch of us gun shy when asking for over 100w and giving us hi temps in return...but that's just a chuckhole in the road to progress. It's hard to build this stuff and make it work for the general public, but we'll all benefit in the long run.
My stuff all runs in the mid 40°C range...all verified by a thermocouple, blah, blah, blah...and I feel I'm somewhere in the ballpark.
The drawing in the first post does not mean you need a fan in the bottom of your case...just that anything in that general area needs to intake cool air. Same applies that exaust fand need to be somewhere near the top or rear.
Reversing airflow thru a case works too. Cases that allow this do require a pretty good paycheck to purchase and the same basic understanding of the concepts in the first post of this thread to make work. The mechanics of hot air rising just does not go away...and will not.
I'd like to hear more discussion here...
That kind of great cooling is generally impossible with most cases that can be purchased today. Case manufacturers will offer pretty (what they want us to believe is pretty), lot's of front panel plugins (to help block proper airflow), and slick lookin' front panels (to insure we block any real airflow) at an inflated price so we can all be cool.
Problem is, we're cool and our components are anything but cool.
Nothing wrong with a side panel fan blowing in if it really helps. If that fan just serves to give a false reading because it blows cool air on a sensor...we lose.
If that side panel fan disrupts proper airflow thru the case...we lose.
The Intel solution of a duct blowing directly on the hsf is a pretty good idea...much better that just tossing air at whatever.
Other solutions like the badong stuff kind of work; Sidney Wong's Chill Vent ducting does work; our homegrown solutions might work.
Good basic cooling as shown in first post of this thread always works...always.
Everything out here that we can consider a cooling solution depends on good basic airflow thru a case. Water, phase change, hsf...it all depends on air flowing over the top to carry heat away.
Consider what a friend once told me. We can have cool, we can have cheap, and we can have quiet. Problem is; we can only have two out of three.
Chips and chipsets are getting better. We will enjoy lower temps and power requirements in the future. The P4E made a bunch of us gun shy when asking for over 100w and giving us hi temps in return...but that's just a chuckhole in the road to progress. It's hard to build this stuff and make it work for the general public, but we'll all benefit in the long run.
My stuff all runs in the mid 40°C range...all verified by a thermocouple, blah, blah, blah...and I feel I'm somewhere in the ballpark.
The drawing in the first post does not mean you need a fan in the bottom of your case...just that anything in that general area needs to intake cool air. Same applies that exaust fand need to be somewhere near the top or rear.
Reversing airflow thru a case works too. Cases that allow this do require a pretty good paycheck to purchase and the same basic understanding of the concepts in the first post of this thread to make work. The mechanics of hot air rising just does not go away...and will not.
I'd like to hear more discussion here...
