Hi all!
I am going to start a new build soon - I have all the parts - but looking at the stock heat sink (which I plan to replace with water cooling sooner or later), it already has some thermal pads on it. It has one long strip in the center, and two square-ish patches on either side of that. Inbetween these is bare copper.
Now, I know too much thermal paste/compond actually creates more heat, but this doesn't seem like a lot. It doesn't even cover half of the chip's serface area. The ivy bridge is known to be hotter too (Intell using crapy thermal compound within the chip).
Should I add more thermal paste?
I am going to start a new build soon - I have all the parts - but looking at the stock heat sink (which I plan to replace with water cooling sooner or later), it already has some thermal pads on it. It has one long strip in the center, and two square-ish patches on either side of that. Inbetween these is bare copper.
Now, I know too much thermal paste/compond actually creates more heat, but this doesn't seem like a lot. It doesn't even cover half of the chip's serface area. The ivy bridge is known to be hotter too (Intell using crapy thermal compound within the chip).
Should I add more thermal paste?