In the next month or so I will be getting phase change to take my chip higher. My 640 has been great on air but I really want to push it to the max. Here are some things to think about for anyone wanting to get into phase change and how its different from air and water cooling. For more info on how phase change works look here http://www.sysxtreme.com/showthread.php?t=892
Thermal Paste-
Cooling with air or water the popular paste and imo the best is Artic Silver 5. The problem with using as5 in phase change is its silver based and conducts electricity. If the processors pens are coated with this it will cause a short circuit and damage your hardware. Nonelectrical paste such as Artic Alumina or Ceramique are much better choices.
Coating Underside of Socket-
The subzero temps that are achieved by phase change can make condensation a problem. The same way that water droplets form on the outside of a glass in the heat can form on and around the cpu because of the way below ambient temps. To decrease the condensation you need to coat the entire socket and cpu underside with paste.
Connecting a Fan to the CPU header-
Some motherboards wont boot up unless you have a fan connected to the cpu fan header. If your rig wont boot up after installing a phase change system connect a fan to the 3 pin header.
Insulation on Motherboards Underside-
A vital part of phase change is insulating the underside with the adhesive foam insulation that comes with your system. Installing this creates a barrier between the hardware that operates at the subzero temps making condensation very hard to form. Heating elements are included in most cases with vapor systems to help the condensation around the evaporator. It could come off as counteractive to add heat but you need to keep the “clamshell” (evaporator housing) right around ambient temp.
I will go into more detail with this guide when I get my system and have a little more hands on experience.
Thermal Paste-
Cooling with air or water the popular paste and imo the best is Artic Silver 5. The problem with using as5 in phase change is its silver based and conducts electricity. If the processors pens are coated with this it will cause a short circuit and damage your hardware. Nonelectrical paste such as Artic Alumina or Ceramique are much better choices.
Coating Underside of Socket-
The subzero temps that are achieved by phase change can make condensation a problem. The same way that water droplets form on the outside of a glass in the heat can form on and around the cpu because of the way below ambient temps. To decrease the condensation you need to coat the entire socket and cpu underside with paste.
Connecting a Fan to the CPU header-
Some motherboards wont boot up unless you have a fan connected to the cpu fan header. If your rig wont boot up after installing a phase change system connect a fan to the 3 pin header.
Insulation on Motherboards Underside-
A vital part of phase change is insulating the underside with the adhesive foam insulation that comes with your system. Installing this creates a barrier between the hardware that operates at the subzero temps making condensation very hard to form. Heating elements are included in most cases with vapor systems to help the condensation around the evaporator. It could come off as counteractive to add heat but you need to keep the “clamshell” (evaporator housing) right around ambient temp.
I will go into more detail with this guide when I get my system and have a little more hands on experience.
