You did misread my comment because you assumed I was talking about Intel not soldering
"Earlier this year Intel Corp.’s
promised that its Core i7-4790K and Core i7-4690K “Devil’s Canyon” microprocessors will have considerably better overclocking potential compared to the original chips based on the “Haswell” micro-architecture released last year thanks to i
mproved thermal interface between the die and the heat-spreader as well as revamped power supply circuity. However, actual overclocking attempts of a Core i7-4790K central processing unit by KitGuru’s reviewer Luke Hill did not reveal any breakthroughs. Apparently, the reason for that is quite simple: the new thermal interface that Intel uses still has limited efficiency."
"In both cases Intel’s NGPTIM could only outperform KPT-8 (an old thermal paste developed in 1974 in the USSR) paste and was less efficient than inexpensive Arctic Cooling MX-2. Highly-efficient Coollaboratory Liquid Pro compound proved to be dramatically better than Intel’s NGPTIM"
source
The actual test report is in Russian
This was the point I was trying to make. Intel had admitted their TIM (havent found the link yet) wasn't good enough (and at the time the report quoted "low quality") and had improved it. However it still isn't good enough. Yes its compared to aftermarket TIM but the point still stands. At least they came through on their promise to improve the TIM.
Im not out to make some childish "i told you so" comment. This community is better than that. I was trying to state that Intel did cut corners. Lets face it, companies who can do this, will try to do this. Ivy bridge they suffered since it was the first time away from soldering so the backlash was great. What made it worse was the quality was very poor.
The issue that still stands right though is that the IHS gap is too large. Not sure if its fixed in Kaby Lake or new batches of Skylake but the problem is there.