In 28 crisp, clear images, you’ll learn the manufacturing steps that Intel has used to become the world’s most successful chip company. While Intel’s microprocessor manufacturing process includes hundreds of steps, these are most important ones. Take a look! Chip-making will no longer be a mystery to you.
Sand has high percentages of silicon dioxide (SiO2), the second most frequent chemical element in the earth's crust, and is the base ingredient for semiconductor manufacturing.
Melted silicon. It takes multiple purification steps to reach semiconductor manufacturing quality. Electronic grade silicon may only have one alien atom in every one billion silicon atoms. This picture shows how one big crystal is grown from the purified silicon melt.
A mono-crystal silicon ingot, produced from electronic grade silicon, weighs about 100 kilograms (roughly 220 pounds) and has a silicon purity of 99.9999%.
Ingot slicing. The ingot is cut into individual silicon discs called “wafers.”
Wafers are polished until they have flawless, mirror-smooth surfaces. Third-party companies supply Intel with ready-to-manufacture wafers. Intel’s 45nm High-K/Metal Gate process uses wafers with a diameter of 300mm (12 in).
Applying photo resist (wafer level). Liquid (blue color) is poured onto the wafer while it spins, making a photo-resist finish similar as the used in film photography. Spinning the wafer applies a thin and even application.
Exposure of the photo resist finish to ultra violet (UV) light triggers a chemical reaction similar to letting light hit the film in a camera when you press the shutter. Stencil-like masks create circuit patterns on each layer of the microprocessor. A lens (middle) reduces the mask's image, so the printed circuit is typically four times smaller than the mask's pattern. The part of the finish that's exposed to UV light becomes soluble.
Exposure creates hundreds of microprocessors on a single wafer. In each processor, transistors acts as switches, controlling the flow of electrical current in the chip. About 30 million transistors could fit on the head of a pin.
Washing off of photo resist. The gooey photo resist is completely dissolved by a solvent, revealing a pattern of photo resist made by the mask.
Etching removes any photo resist material that is not protected by the mask pattern. Chemicals etch away revealed material.
Removing photo resist. After the etching step, the photo resist is removed and the desired shape of the transistor becomes visible.
Applying Photo Resist (transistor level). More photo resist (blue color) is applied and exposed; the exposed photo resist is washed off before the next step. This photo resist protects some material from having ions implanted.
Ion Implantation—one form of this process is called doping—shoots chemical impurities called “ions” onto the wafer’s surface at a speed 300,000 km/h (about 185,000 mph). Ions alter electricity conduction in the exposed areas.
Removing photo resist. After ion implantation, the photo resist is removed and the material that should have been doped (green color) has alien atoms implanted now. (Notice slight variations in color.)
Ready Transistor. This transistor is close to being finished. Three holes etched into the insulation layer (magenta color) above the transistor will be filled with copper that makes the connections to other transistors.
Electroplating. The wafers are put into a copper sulphate solution and copper ions are deposited onto the transistor. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode), the wafer itself.
After electroplating, the copper ions settle as a thin layer of copper on the wafer surface.
Polishing. The excess material is polished off.
Metal layers are created to interconnect the various transistors (think wires) to provide the processor’s model-specific functions. Magnified, these layers of complex circuitry look like a futuristic, multi-layered highway system.
Wafer Sort Test. On this fraction of a ready wafer, test patterns are fed into every single chip and the chip’s response is compared to "the right answer."
Wafer slicing. The wafer is cut into pieces called “dies.”
Discarding faulty dies. The dies that responded with the right answer to the test pattern are put forward for the next step: packaging.
Individual die, like this one, are cut out in the wafer slicing step. The die of an Intel® Core™ i7 Processor die is shown here.
Packaging combines substrate, die, and heatspreader in a completed processor. The substrate (green color) connects the die to the rest of the PC system. The heatspreader (silver color) keeps the processor cool during operation.
Completed chips like this Intel® Core™ i7 processor are the most complex manufactured product on earth, created through hundreds of steps in the world's cleanest environment.
Class testing. During this final test, processors are tested for key characteristics such as power dissipation and maximum frequency.
Binning. Based on the results of class testing, processors with the same capabilities are put into the specific transporting trays.
Retail Package. Manufactured and tested processors are shipped to system manufacturers in trays or to retail stores in a box (shown here).
Sand has high percentages of silicon dioxide (SiO2), the second most frequent chemical element in the earth's crust, and is the base ingredient for semiconductor manufacturing.
Melted silicon. It takes multiple purification steps to reach semiconductor manufacturing quality. Electronic grade silicon may only have one alien atom in every one billion silicon atoms. This picture shows how one big crystal is grown from the purified silicon melt.
A mono-crystal silicon ingot, produced from electronic grade silicon, weighs about 100 kilograms (roughly 220 pounds) and has a silicon purity of 99.9999%.
Ingot slicing. The ingot is cut into individual silicon discs called “wafers.”
Wafers are polished until they have flawless, mirror-smooth surfaces. Third-party companies supply Intel with ready-to-manufacture wafers. Intel’s 45nm High-K/Metal Gate process uses wafers with a diameter of 300mm (12 in).
Applying photo resist (wafer level). Liquid (blue color) is poured onto the wafer while it spins, making a photo-resist finish similar as the used in film photography. Spinning the wafer applies a thin and even application.
Exposure of the photo resist finish to ultra violet (UV) light triggers a chemical reaction similar to letting light hit the film in a camera when you press the shutter. Stencil-like masks create circuit patterns on each layer of the microprocessor. A lens (middle) reduces the mask's image, so the printed circuit is typically four times smaller than the mask's pattern. The part of the finish that's exposed to UV light becomes soluble.
Exposure creates hundreds of microprocessors on a single wafer. In each processor, transistors acts as switches, controlling the flow of electrical current in the chip. About 30 million transistors could fit on the head of a pin.
Washing off of photo resist. The gooey photo resist is completely dissolved by a solvent, revealing a pattern of photo resist made by the mask.
Etching removes any photo resist material that is not protected by the mask pattern. Chemicals etch away revealed material.
Removing photo resist. After the etching step, the photo resist is removed and the desired shape of the transistor becomes visible.
Applying Photo Resist (transistor level). More photo resist (blue color) is applied and exposed; the exposed photo resist is washed off before the next step. This photo resist protects some material from having ions implanted.
Ion Implantation—one form of this process is called doping—shoots chemical impurities called “ions” onto the wafer’s surface at a speed 300,000 km/h (about 185,000 mph). Ions alter electricity conduction in the exposed areas.
Removing photo resist. After ion implantation, the photo resist is removed and the material that should have been doped (green color) has alien atoms implanted now. (Notice slight variations in color.)
Ready Transistor. This transistor is close to being finished. Three holes etched into the insulation layer (magenta color) above the transistor will be filled with copper that makes the connections to other transistors.
Electroplating. The wafers are put into a copper sulphate solution and copper ions are deposited onto the transistor. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode), the wafer itself.
After electroplating, the copper ions settle as a thin layer of copper on the wafer surface.
Polishing. The excess material is polished off.
Metal layers are created to interconnect the various transistors (think wires) to provide the processor’s model-specific functions. Magnified, these layers of complex circuitry look like a futuristic, multi-layered highway system.
Wafer Sort Test. On this fraction of a ready wafer, test patterns are fed into every single chip and the chip’s response is compared to "the right answer."
Wafer slicing. The wafer is cut into pieces called “dies.”
Discarding faulty dies. The dies that responded with the right answer to the test pattern are put forward for the next step: packaging.
Individual die, like this one, are cut out in the wafer slicing step. The die of an Intel® Core™ i7 Processor die is shown here.
Packaging combines substrate, die, and heatspreader in a completed processor. The substrate (green color) connects the die to the rest of the PC system. The heatspreader (silver color) keeps the processor cool during operation.
Completed chips like this Intel® Core™ i7 processor are the most complex manufactured product on earth, created through hundreds of steps in the world's cleanest environment.
Class testing. During this final test, processors are tested for key characteristics such as power dissipation and maximum frequency.
Binning. Based on the results of class testing, processors with the same capabilities are put into the specific transporting trays.
Retail Package. Manufactured and tested processors are shipped to system manufacturers in trays or to retail stores in a box (shown here).
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