If they didn't change the TIM then temps wouldn't be lower.
The type of TIM is an upgrade version known as next-generation polymer or NGPTIM.
I don't think you saw my earlier comment but the IHS is thinner so it is better for heat transfer.
I saw it, but the TIM is still a upgraded version of what they were using on the previous chips. The thinner IHS helps but the upgraded TIM is also a main contributor.
Well I'm only going off of what the worlds current top overclocker is saying so if he's wrong I guess your right as you must have it right infront of you![]()
Review -I think your maximum OC target will be roughly 4600 ~ 4700 MHz if you search 100% stability. Our 4800 MHz tweak was stable enough, but not stable enough for hours of 100% CPU load. And at that stage we already needed 1.4 Volts. I am still running some overclock tests and right now I am at 1.45 Volts / 4800 MHz. This for now is 100% stable however temps are growing to roughly 85 Degrees C.
Another disappointing review, This time from Guru3D -
Review -
http://www.guru3d.com/articles_pages/core_i7_4790k_processor_review,1.html
lol, try putting 1.4v through a 4770k and not having it melt. The 4790k has 1.4v going through it and temps are still ok.
A conventional thermal paste on a delidded 4770K can lower overall load temperatures by ~10 degrees and with CLU/CLP you can hit 20 degrees less peak temp.
Toms test with both cpus @ 4.2 GHz and 1.275V shows that there's just 6C of deltaT between 4770k and 4790k load temps
Moreover I'd never advise someone to keep a 22nm cpu at 1.4V for a daily OC.
Either way I don't really see the point in this release, Would of been better to just put those resources towards the next REAL performance jump.
I'd be surprized if they weren't.Im now of the belief that this release was done just to sale some backstock 4770K's. They're the exact same die and a guy on HardOCP identified the date code on the ES as being built in August of last year!