Soldered IHS for Next Gen 8 core i7 / i9 ? ? ?

All K and X models should be soldered if possibly. I really feel Intel slowly dug their own grave by not doing it, when they could
 
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i believe it when i see it.


some 9 series CPU´s are soldered and others not.... not sure if that makes sense.
would it really that more expensive to solder all 9 series CPU´s??
 
All K and X models should be soldered if possibly. I really feel Intel slowly dug their own grave by not doing it, when they could

Not necessarily. While we do prefer it, Soldered die does have the potential for issues later on down the line. Thermal cycling etc.

With old CPU the PCB was thicker and had more strength, but since skylake, the rigity of the pcb was less. Obviously its not a valid excuse for Intel and they did go completely cheap but I think there is more to it then many of us understand. They are perfectly capable of it, but unless they can make 100% profit on sales, they won't do it.

Soldered on die brings extra cost. If they could lay that cost on us via a cost+ model, and we would still pay then sure, but if they had to normalise sales (taking in inflation) it means the solder extra expense would cut into their revenue, which is a no no for them.

AMD on the other hand just go for it.
 
I agree with Warchild. There are benefits to using Intel's current TIM, and up until now has likely been the most economical solution for them. With these eight core CPUs though that they want to clock to 5Ghz on two cores and 4.6Ghz on all eight cores, to remain competitive against AMD in the temperatures department, they might have to use solder, despite not wanting to. And that's nothing to do with user overclocking. That's because of the higher core count and because Intel have increased the clock speed themselves without a die shrink. Using it in the lower end SKUs therefore still might not make enough sense to them financially. People will buy i5s and i3s by the lorry loads, so why bother?
 
Solder is good. Increasing the price because of it is bad.
Prices need to be good and performance needs to be a big step up for them. If right now I can buy a 6 core 12 thread for a little over £300, why am would I buy an 8 core with no ht for the same money. The performance has got to be really good when I can get an 8 core 16 thread for around £100 less and performance that in my eyes is not £100 worth.
 
Not necessarily. While we do prefer it, Soldered die does have the potential for issues later on down the line. Thermal cycling etc.

yeah well i think that is a theoretical problem.


i have sold old CPUs to friends who still use them.
some are 14 years old. :-)


some sandy bridge cpus from 2011 are still running OC to 4.5 GHz in friends systems.

since ~2000 i always had 6 systems running in my renderfarm.
so i buy a lot of cpu´s and they run often for days under full load.

i guess that is a theoretical problem.... sure not a problem for me.
i don´t use a CPU longer than 5-6 years.

actually prior to sandy bridge i never used a CPU for longer than 3 years.
but with intels babysteps after sandy bridge, it made no sense to update. even updating every 2 generations made no real sense.
 
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so i buy a lot of cpu´s and they run often for days under full load.

That's not a problem with solder. The problem is shifts in temperature. So turning it on (20c), full oc load (80c) turning the computer of. Then every day for years. It expands and contracts everytime, and that can leave cracks in the solder/cpu.
 
All K and X models should be soldered if possibly. I really feel Intel slowly dug their own grave by not doing it, when they could

They were doing fine, right up to the point they were caught in a lie. Then they told more lies to get out of that lie and every one sat and watched.
 
Unfortunately engineering is governed by profitability.
Engineers love to make the 'best' product they can
Managers want to make the most profitable product they can
To spend even an extra $0.01 per cpu is a serious consideration
Check out lean manufacturing and economies of scale.

if intel was able to use a cheaper thermal interface between the die and the IHS and still produce a reliable product that ran inside of spec then they would

if the specification changes, say a clock speed increase, and the previous solution is no longer viable then the engineers need to look at ways to solve the problem.

The solution that has the least drawbacks is the one that's chosen, there is no should do this should not do that. Engineering is a field of compromise, building a system or product that performs the best is not a challenge. Building one that meets all criteria is.
 
Simple fact of the matter is that Intel solder their High clocked, high TDP (usually above 95w) CPUs.

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