Land Grid Array (LGA) Top-side Probes
Intel® Core™ i7 processors and the Intel® Xeon® processor 5500 series use LGA1366 sockets, similar in design to the LGA775/771 sockets. However, the high speeds of these processors mean that the use of an interposer between the socket and the CPU could interfere with signal integrity. Intel has therefore provided pads on the top side of the CPU, which mirror the required signals. To access these top-side pads, ASSET has developed a top-side probe.
The LGA1366 top-side probe consists of a PCB with a ring connector attached below it that contains small, spring-loaded probe tips. These tips make contact with the CPU's top-side pads, allowing the debug port signals to be broken out onto a flexible cable, which terminates in a small PCB carrying a Intel®-specified XDP header. The standard socket load mechanism is used above the probe's PCB to depress the CPU into its socket. The heatsink and fan are mounted onto a heatsink location plate supplied with the probe.