OC3D Review: Microcool Mosfet Heatsinks

When they get hot, they can cause voltage fluctuation which can make your computer unstable at a certain point.
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the warmer mosfets gets the less power can flow through them so im not so sure the voltage starts to fluctuate but more gets lower but can be wrong.
 
that's made from alumunium right? if that's made from copper,is better i think..:D (cause cooper 3x alumunium in heat spreading i think)

later,
 
name='systech' said:
that's made from alumunium right? if that's made from copper,is better i think..:D (cause cooper 3x alumunium in heat spreading i think)
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depends on.

aluminium is better than copper to transfer heat to the air so with a low airflow aluminium is better.

you can se the same thing in reviews on the zalman 7000b.

at the lowest fan setting the alcu performs the same as the cu but at max fan settings the cu is roughly 2 celsius better.
 
o right didnt know they made such things! i was trying to get all that hot air from my GFX down at the bottom of my case away.... perfect! :)
 
i base it on 2 things.

several reviews claiming the alcu and cu version of the zalman 7000 performs basicly the same with fan at lowest setting and cu being around 1-2celsius better with the fan at full speed but also that i read a couple of times that aluminium has better heat dissipation and copper best heat transfer.
 
Hmm odd. having just finished my A level phyisics corse and myself done experiments involving the SHC and SLH values of both al and cu. I think that copper is better full stop. spray a copper block black and your sorted.
 
yea i was going to give a lecture on a-level physics and some degree level chemistry on thermal conductivity but i thought i would bore people!
 
name='blackrain' said:
yea i was going to give a lecture on a-level physics and some degree level chemistry on thermal conductivity
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I'll see your A-level physics and degree level Chemistry and raise it...:D .In this context, it all comes down to the requirement for a low coefficient of thermal expansion or CTE. Sure, Cu is great as a thermal conductor but it has a high CTE. In order for superior heat dissipation to occur both the heatsink and chip substrate/IHS need to have a low CTE. Due to the need for 'lightweight' materials to be used on PCB's etc, a materials density comes into play, and this is why Al is quite often used due to it being so light. But Cu definitely has far superior thermal conductivity and lower CTE than Al. Further, if we bring another player into the equation, carbon/ carbon fibre has the added bonus of being corrosion/oxididation resistant, when compared to Cu and Al. HS manufacturers should a bring out a copper composite heatsink, using either carbon fibre or molybdenum, but I'm sure the cost would far outway the benefits LOL. Copper is better, but we are only commenting on mosfets :)
 
Yep put in laymens terms:

Copper transfers heat better but Aluminium weighs less.

All in all their mosfets + memory coolers so it doesn't really matter :p
 
If you got the money you could get a platinum plated HS with mercury filled heatpipes........that would be mad (A level chem and phys also :))

Also. aluminium probably seems better at low airflow as it very often has a matt finish
 
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