FragTek said:
Hrmmm, yeah that'd be pretty cool... You'd hafta have 3 additional fucking psu's though, lol.
What would happen if you vapo'd the hot side of a pelt? Would the cold side get colder than the vapo?
in short yes this would work the pelt would get crazily low temps , prob is may g oso cold and turn the Mobo/graphs card (whateva mounted on) soo cold that even the slightest movement may snap it and interestingly when certain ceramics get colder the electrica resistance would get lower and so the pelt would get even coolder
<from http://www.electronics-cooling.com/Resources/EC_Articles/SEP96/sep96_04.htm>
Thermal Parameters Needed
The appropriate thermoelectric for an application, depends on at least three parameters. These parameters are the hot surface temperature (Th), the cold surface temperature (Tc), and the heat load to be absorbed at the cold surface (Qc).
The hot side of the thermoelectric is the side where heat is released when DC power is applied. This side is attached to the heat sink. When using an air cooled heat sink (natural or forced convection), the hot side temperature can be found by using Equations 1 and 2.
(1) Th = Tamb + (O) (Qh)
Where
Th = The hot side temperature (°C).
Tamb = The ambient temperature (°C).
O = Thermal resistance of heat exchanger (°C/watt).
and
(2) Qh = Qc + Pin
Where
Qh = the heat released to the hot side of the thermoelectric (watts).
Qc = the heat absorbed from the cold side (watts).
Pin = the electrical input power to the thermoelectric (watts).
The thermal resistance of the heat sink causes a temperature rise above ambient. If the thermal resistance of the heat sink is unknown, then estimates of acceptable temperature rise above ambient are:
Natural Convection 20°C to 40°C
Forced Convection 10°C to 15°C
Liquid Cooling 2°C to 5°C (rise above the liquid coolant temperature)
The heat sink is a key component in the assembly. A heat sink that is too small means that the desired cold side temperature may not be obtained.
The cold side of the thermoelectric is the side that gets cold when DC power is applied. This side may need to be colder than the desired temperature of the cooled object. This is especially true when the cold side is not in direct contact with the object, such as when cooling an enclosure.
The temperature difference across the thermoelectric (T) relates to Th and Tc according to Equation 3.
(3) T = Th - Tc
The thermoelectric performance curves in Figures 2 and 3 show the relationship between T and the other parameters.
Estimating Qc, the heat load in watts absorbed from the cold side is difficult, because all thermal loads in the design must be considered. Among these thermal loads are:
1. Active: I2R heat load from the electronic devices
Any load generated by a chemical reaction
2. Passive: Radiation (heat loss between two close objects with different temperatures)
Convection (heat loss through the air, where the air has a different temperature than the object)
Insulation Losses
Conduction Losses (heat loss through leads, screws, etc.)
Transient Load (time required to change the temperature of an object)
That'd be fly if the whole concept worked. It seems thats if u were to keep the hot side at sub zero temperatures that the cold side would be COLD COLD COLD.
