WYP
News Guru
A low power processor that can pack a punch when needed.
Read more about Intel's hybrid x86 big.LITTLE processor design.
Read more about Intel's hybrid x86 big.LITTLE processor design.
Intel shows of x86 CPU with big.LITTLE core design
- Thread starter WYP
- Start date
NeverBackDown
AMD Enthusiast
Intel the past few days shows us they can still change. About time. The stagnation they have had for the past 10 years may finally be over(starting by missing the mobile market entirely).
AlienALX
Active member
Aye it's literally like we've been an afterthought for ten years.
Will be nice to see some actual competition again.
Perhaps its because they felt they didnt need to when they lacked the competition. But in recent months, we see AMD hot on their heels, if not edging ahead.
Now it means Intel need to really think out of the box to get that dominant lead back. Let's face it, its neck and neck right now. What we have seen in the last few days seem like things they have been looking into for quite a while, but never considered it worth pursuing until now. Seems like they are proving the world why they are still the best with these innovations.
This doesn't really have anything to do with reacting to AMD or their competitive footing(Beyond timing or wording of press releases), different markets, different timescales.
-The fundamental tech behind this Fovoros technology, and the concept of large scale Multi-chip-modules, has been in research or development for decades, and even this specific implementation of interposer stacking would have been many years in the making.
-This hybrid design was done at the request of a third party client for a specific use case and not for competing on the open market, and is for a power envelope AMD was no where near targeting when development would have started(And that's possibly why it did).
-The fundamental tech behind this Fovoros technology, and the concept of large scale Multi-chip-modules, has been in research or development for decades, and even this specific implementation of interposer stacking would have been many years in the making.
-This hybrid design was done at the request of a third party client for a specific use case and not for competing on the open market, and is for a power envelope AMD was no where near targeting when development would have started(And that's possibly why it did).
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