Intel brings 3D processors to market with its Hybrid Lakefield chips

[WYP]

A revolutionary architecture for low-power x86 environments.



Read more about Intel's 3D Lakefield Hybrid processors.

 

[NeverBackDown]

It's mind boggling to even think how it's physically possible to do this in such a tiny area of space. This is some pretty impressive stuff.

I'm just not sure what market it would serve outside of maybe tablets or cars

 

[Kleptobot]

3D packages will suffer from less efficient heat dissipation, makes sense to target this technology at low TDP solutions.