Cern reveals AMD 32-core Zen CPU with 8 channel DDR4 memory

TBH there are so many unknowns right now. It is hard to tell how things will go really.

This next gen of CPUs and APUs will not be using HBM, but on the APU side they will get a boost from fast DDR4 given how much they loved fast DDR3.

HBM is too expensive right now to use in APUs, though I'm sure it is on the roadmap for AMD.

APUs with HBM have a lot of potential, especially on mobile devices and consoles where device makers like all the heat concentrated on one place for cooling and space savings.

One of the main reasons why the consoles are on AMD is that they could deliver a CPU and a GPU in one die, simplifying the design significantly. If they can add the memory on the die for future consoles then it is even simpler.

Very true! I think at the earliest of any sort of CPU/APU with HBM on die probably happens Q4 2017 at the earliest.

I can very well see the next consoles having HBM, Hopefully anyway.

It would be a pretty big step up over GDDR5 and they could get much more quantity with it and have memory amount/speed be less of an issue for consoles over the course of it's life. HBM is the way forward until something else amazing comes out it very well seems.
 
HBM on a CPU.... Really... I don't think so, people are really jumping the gun with this idea, yes it is possible with GPUs and it is being done as we know but not for CPUs. Such a task would mean total socket and motherboard changes on an industry standard level.

HBM on die controllers and HBM DDR dimms, now that's a tasty thought. So are APUs with healthy HBM its going to make for a tech fun filled future.
 
HBM on a CPU.... Really... I don't think so, people are really jumping the gun with this idea, yes it is possible with GPUs and it is being done as we know but not for CPUs. Such a task would mean total socket and motherboard changes on an industry standard level.

HBM on die controllers and HBM DDR dimms, now that's a tasty thought. So are APUs with healthy HBM its going to make for a tech fun filled future.

It's definitely possible. Both with APUs and CPUs. Obviously first it will be done with the APU however it has much potential. AMD has the placement in the industry to influence standards and they have done so before. I wouldn't be surprised if they started on this already. Plus you have to remember it doesn't need to change the industry.. it could quite easily be a SoC custom design, which also happens to be most popular in consoles. It's possible they get it before us and with the next gen not coming anytime soon the technology will be there.
So like I said(as have others in the thread), it's possible. We aren't making any fanboy wet dreams here, we just said it's possible for the CPU to get it too and it eventually will contain some type of memory on die in the future as that is the way forward technologically.

Oh and just a question, wouldn't making HBM dimms and on dies also have to change on a industry level too? Just like putting it on an APU/CPU?;) Every advance will change it not matter what:)
 
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We already have imc's on cpus, it would be HBM imc's next then introduce HBM stacks on dimms which already have their slots so no need to change anything within the industry. The huge issue with cpus getting HBM onboard would be that AMD and Intel would knock all the memory suppliers out of the market and capitalise as they won't be needed anymore.
 
i thought one of the main advantages of HBM as it is currently implemented on the AMD GPUs is that it is so close to the cpu die and shares the same substrate with the cpu die allowing it to have a massively wide bus and very short traces? i don't think that HBM dims would be as advantageous
 
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