TBH there are so many unknowns right now. It is hard to tell how things will go really.
This next gen of CPUs and APUs will not be using HBM, but on the APU side they will get a boost from fast DDR4 given how much they loved fast DDR3.
HBM is too expensive right now to use in APUs, though I'm sure it is on the roadmap for AMD.
APUs with HBM have a lot of potential, especially on mobile devices and consoles where device makers like all the heat concentrated on one place for cooling and space savings.
One of the main reasons why the consoles are on AMD is that they could deliver a CPU and a GPU in one die, simplifying the design significantly. If they can add the memory on the die for future consoles then it is even simpler.