nothingspecial
New member
Yet another interesting nugget of information.
http://www.techpowerup.com/153567/AMD-to-Turn-to-TSMC-for-Bulldozer-Manufacturing.html
Seems the problem could be Global Foundries and the fab process after all. Else why would they swich to TSMC? Could also back up the B3 stepping and shipping delay...
http://www.techpowerup.com/153567/AMD-to-Turn-to-TSMC-for-Bulldozer-Manufacturing.html
name="TechPowerUp" said:AMD to Turn to TSMC for ''Bulldozer'' Manufacturing
AMD is rumored to be seeking ties with TSMC, Taiwan's premier semiconductor manufacturing foundry, for future manufacturing of its "Bulldozer" architecture processors, according to a report by DonanimHaber. This has two very distinct implications: first, AMD could be facing issues with GlobalFoundries 32 nm HKMG node, its de facto foundry for CPU manufacturing, and second, this could just be an obvious development of future low-power APUs based on the new x86 architecture being manufactured at TSMC, much like how current E-series and C-series APUs are.
Then again, AMD doesn't exactly have any APUs in works that use "Bulldozer" architecture for the x86 cores, rather, its successor codenamed "Piledriver". Another couple of important things to note here are that TSMC does not have a 32 nm bulk node (it was scrapped with the transition to 28 nm bulk), and its HKMG (high-K metal gate transistor) manufacturing technology is deployed rather recently. It would be interesting to follow this development.
Seems the problem could be Global Foundries and the fab process after all. Else why would they swich to TSMC? Could also back up the B3 stepping and shipping delay...