TSMC reveals Wafer-on-Wafer chip stacking technology - WoW!

[WYP]

Stacking wafers to deliver a new form of inter-die connectivity.



Read more about TSMC's Wafer-on-Wafer chip stacking technology.

 

[TheF34RChannel]

Now that's progress!

 

[NeverBackDown]

Pretty cool. I would imagine this would help a lot for mobile however considering they have to produce so many it probably will be a while before they are able to get good enough yields.

 

[meuvoy]

LOL, the lower wafer in the stack will burn like a star having to conduct it's heat trough all the other layers before it reaches the heatsink.

 

[NeverBackDown]

LOL, the lower wafer in the stack will burn like a star having to conduct it's heat trough all the other layers before it reaches the heatsink.

The idea is the low power stuff is on the bottom, like cache and dedicated encoder/decoder and perhaps memory controller, while the top layer is just connected cores.

That's from the patent filings TSMC published.