Skylake delidding, does it improve thermals?

[Agost]

Excuse me guys -snip

...just what I wrote in the post above yours

 

[SuB]

Excuse me guys but i think we are all wrong about the real causes of this annoying overheating problem on the last Intel CPU generations, it's not rellated to thermal interface, take a look at this:
I found these graphics on anandtech forum, some guy thougth the reason could be other and let me say i did a similar experience trying to put some glue between the IHS and PCB and reached the same conclusion, themperatures went worse directly proportional to the gap between them despite the TIM used.

Well yes of course it did, TIM isn't meant to be used as filler for gaps like that, it's mean to fill microscopic surface imperfections, which a lot of people seem to forget.
The best contact you can have is direct surface to surface. NOT through TIM, TIM is just there to fill the microscopic pits and holes that are IN the surfaces of the two components you are trying to transfer heat between. Because those gaps fill with air, and air is possibly one of the worst things to transfer heat through. It's basically a insulator so TIM is there to avoid having air anywhere between the two surfaces, while still maintaining as much surface to surface contact as possible.

With TIM... less, really truly and actually is more/better.

That's why we LAP things!! to make the surface smoother and have less imperfections!!!

 

[BigDaddyKong]

I think its because Intel knows its chips are more voltage limited than heat limited. They want them to throttle before we get voltage degradation.