Bom Bom BOM ... reason to ivy temps!

[unknownuser200]

http://www.techpowerup.com/164858/Ivy-Bridge-Temperatures-Could-Be-Linked-To-TIM-Inside-Integrated-Heatspreader-Report.html

PC enthusiasts with Ivy Bridge engineering samples, and reviewers at large have come to the consensus that Ivy Bridge is a slightly warmer chip than it should be. An investigation by Overclockers.com revealed a possible contributing factor to that. Upon carefully removing the integrated heatspreader (IHS) of an Ivy Bridge Core processor (that steel plate on top of the processor which makes contact with the cooler), the investigator found common thermal paste between the CPU die and the IHS, and along the sides of the die.

In comparison, Intel used flux-less solder to bind the IHS to the die on previous-generation Sandy Bridge Core processors in the LGA1155 package. Attempting to remove IHS off a chip with flux-less solder won't end well, as it could rip the die off the package. On the other hand, the idea behind use of flux-less solder in CPU packages is to improve heat transfer between the die and the IHS. Using thermal paste to do the job results in slightly inferior heat transfer, but removing IHS is safer. One can be sure that making it safe for IHS removal couldn't have been the issue behind switching back to conventional thermal paste, as everything under the IHS isn't user-serviceable anyway, and off limits for them. Perhaps Intel kept extreme overclockers in mind.

pictures lised there

 

[BKCXb]

nice find , I origanally thought they were having a problem bonding the heat spreader to the die, but they ain't even trying too, just a dap of TIM and ship it, ouch!!!

 

[nothingspecial]

Wonder if Tom will have a go at popping the top off one of his and mounting the heatsink directly - assuming he's got more than one engineering sample...

 

[Lollipop]

Hmm... now why would they do that....

 

[Vicey]

Pretty surprising. Maybe they did this to keep extreme overclockers buying the more expensive LGA 2011 platform?

Wouldn't be the first time a company cripples its own products to sell a higher end more expensive part. Or maybe there isn't any conspiracy, they just found it cheaper to use paste and it worked almost as good.

 

[unknownuser200]

i myself think it was to cheap way to cut production cost , and i bet you see a mass complant and revision. then this revision will magically alot cooler

 

[SieB]

i bet you see a mass complant and revision. then this revision will magically alot cooler

I think this will happen as well, there will definitely be a revision and a lot of angry early IB buyers.

 

[PetrolHead247]

Haven't got a clue why they decided to go ahead and do that, but i also can see a new revision being released to fix this too

 

[Lollipop]

Haven't got a clue why they decided to go ahead and do that, but i also can see a new revision being released to fix this too

Fix? lol

 

[PetrolHead247]

Fix? lol

You know what i mean

 

[BKCXb]

well it does say engineering samples, guess we will have to wait ans see what the consumer chips are like.

If they do this to the consumer chips, my worry is when the TIM dries up after a while you would be forced to ripe your IHS and directly cool it.

Now I want to see a test on directly cooling it to see if it does that quick rise in temps or if its more linier rise in temps like it should.

 

[S_I_N]

best way to find out is rip that pup apart and direct die cool it. like we did back in the day when IHS's first started appearing. I did it on my opti's with great results. Remember before IHS all there was ......was direct die contact with the hsf.

 

[Master&Puppet]

or...get a 2500k and wait for haswell.

 

[S_I_N]

well a report on the other thread i saw suggests its not the tim after all as direct die cooling netted no better temps and in some cases worse temps. Most are now suggesting its just the die shrink has less surface area and more stuff on it to dissapate

 

[MaXiMiZe]

Very interesting find...

 

[BKCXb]

Do they make a IB chip without Graphics built in yet?? Or can the iGPU be disabled in the UEFI?

I think the 40% more transistors in a 26% smaller die may be the problem, all the extra transistors are in the iGPU, so lets get them out of there and see if the chip still has trouble.

Only problen I see with the test is they were still using TIM to remove heat from the tiny die, so now that I think about it there should be no differance.

The fact that intel uses solder(which is 10 times more effective) to move heat to the IHS which is 10 times bigger than the die would let TIM remove heat from the IHS effectivly.

TIM dirctly on the die could still be the original problem.

Back in the old days when they diectly cooled dies they were alot lower power chips with massive sized dies.

 

[michaelah500]

Hmm, interesting.

 

[Calibretto]

I'm thinking a 3570K is still worth it for a gaming rig. But my plans to get a super nice expensive mobo and so on are changing.

 

[thehidecheck]

well a report on the other thread i saw suggests its not the tim after all as direct die cooling netted no better temps and in some cases worse temps. Most are now suggesting its just the die shrink has less surface area and more stuff on it to dissapate

Its the even worse that's got me questioning that exact test. I'm gonna wait retail samples to get out and cracked open.

 

[Master&Puppet]

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