I think you are getting confused over terminology.
Binned in die terms means basically tested and very good.
These cards will not be bad higher end ones. No way. The success rate is such on smaller dies that they would never be able to fulfil supply with just bad higher end dies.
Besides I think you'll find that that is what the 9070 GRE is and what the 7900 GRE was.
It's also why these smaller lower end cards come out basically last, because they have to pay for manufacturing time to make them which will detract from more expensive products. So you'll find that once say, 9070 and 9070XT sales slow (after a few months) they will change manufacturing to the cheaper wafers (well, same wafers smaller dies).