90 degree rotation of Prommie 2 head

maverik-sg1

New member
Guys I need your help before I embark on my upgrade.

I now have my mitts on a winchester 3500 and A8N-Sli deluxe MOBO, the PCI Express 6800GT's will be here next week.

I could not wait to have a 'look-see' at the new board and as I gazed in awe of this technological terror something dawned on me.

The head on my Mach2 is mounted to my Prescott via the CPU kit where the bolt holes are horizontal (left to right).

The issue I think I have is that the orientation of the CPU kit on the Sli Motherboard means it will have to connect to the head with the bolt holes being vertical (top to bottom).

Is it OK to twist the head 90 degrees so that it fits the motherboard, if so are there any particular instructions on how to do this?

One piece of constructive advice, would be to include installation instructions with each CPU kit.

If anyone can help me with this, it would be appreciated to post your advice here.

Cheers

Mav
 
Thanks for the information.

If I have read it correctly, the manual states that you use only one layer of seal string on the topside of the CPU kit.

On a review I saw for this is states use two layers.

Which one have you A64 guys gone for?

Is there any benefit to using two layers for installation?

Please advise.

Cheers

Mav
 
maverik-sg1 said:
Thanks for the information.

If I have read it correctly, the manual states that you use only one layer of seal string on the topside of the CPU kit.

On a review I saw for this is states use two layers.

Which one have you A64 guys gone for?

Is there any benefit to using two layers for installation?

Please advise.

Cheers

Mav
I tried using two layers around the topside frst time around thinking it would provide better protection against condensation and it probably does, BUT it was a real bitch trying to get the head off to change CPU. I almost tore the mobo in half - seal string stuck it down too much. After this I used one layer of seal string and for 8 months no sign of condensation ...
 
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