AMD's Athlon 3000G is a game-changer for the budget CPU market
- Thread starter WYP
- Start date
Finally a quality publication giving attention to the most exciting processor to be announced. 
No, seriously, AMD did a good job getting me excited with the sub-$50 pricing and unlocked CPU.
Hopefully someone will delid this and finally settle the question of whether AMD is using special 2C/4T dies, which was generally understood to be the case when the 2nd gen APUs were released, but I haven't seen anyone showing it to be true.
No, seriously, AMD did a good job getting me excited with the sub-$50 pricing and unlocked CPU.Hopefully someone will delid this and finally settle the question of whether AMD is using special 2C/4T dies, which was generally understood to be the case when the 2nd gen APUs were released, but I haven't seen anyone showing it to be true.
There is supposedly a 2c Zen die, such as those used for Banded Kestrel, for which a Zen+ variant could be used as the basis for these upcoming 2c/4t models, but I think so far it's only embedded processors that have used these 2c/4t dies, with the original Zen Athlons (200G and up) being based on cut down 4c/8t APU dies: https://www.youtube.com/watch?v=V2GC_wbJj_8
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Far as I know, nobody proved that Banded Kestrel exists. It was on the roadmap years ago, and I think that AMD did confirm to Anandtech that the 2C Ryzen 3000 Mobile chips are a different die, but I don't remember seeing any official word from AMD or any technical specs for it (such as die size). There was a rumour of a PCIe x4 limitation, but again, I don't think it was ever confirmed.
Naturally not many people would delid a mobile chip, and few enthusiasts have access to embedded ones. An entry level desktop chip is a good opportunity to check this.
It exists, you can see one of the fair few Banded Kestrel devices here: https://www.sapphiretech.com/en/commercial/amd-fs-fp5r
As you can see, the die shape is closer to a square, while the larger APU dies are about a 2:1 rectangle, so it does use a die different from those on the 2c/4t Athlon 200G or V1202B which looks like this:
as opposed to this:
As you can see, the die shape is closer to a square, while the larger APU dies are about a 2:1 rectangle, so it does use a die different from those on the 2c/4t Athlon 200G or V1202B which looks like this:
as opposed to this:
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