XionEternum
New member
Hello, I am new here but hardly new to computer tech. I know my way inside and out with basic components and how LCSs and Phase-Change work. I'm a bit lacking on TECs though and how they work. I get and understand the formula, as well as the TDP variance between the CPU and TEC causing significant inefficiency in some cases. What I don't get is why people haven't tried this:
Imagine if you will, your average PC chassis. Has a nicely spaced 120mm exhaust port on the back next to the rear IO, with plenty of room all around it and possibly even mounting for a 140mm fan. Imagine reverse mounting a downward CPU cooler to it like the CM GeminII or the GeminII S and a decent fan, with the CPU block facing into your chassis. Then imagine placing a low TDP TEC, like 80-250watts, with the hot-side against it, then sandwiching them together with a waterblock on the cold-side. Loop your LCS so that the radiator cooled water passes through this block. Would this be an effective solution to the inefficiency of direct contact with the heat generated by the CPU, by acting as a water chiller instead? Since the expected thermal variance between the hot and cold sides won't exceed 70 degrees, and under this application would likely be getting hit on both sides by ambient temp thermal displacement -air on the hot side and water on the cold side- wouldn't we see the waterblock on it get chilled and thus chill the water flowing through rather well before heading straight to the CPU block? I'm curious if anyone has tried this, or genuinely knows the thermal dynamic properties of this application. Will it work? Has it worked?
Thoughts anyone?
Edit after first two responses:
Okay, I should add to the example as having the following loop sequence:
Res> TEC Block> CPU Block> GPU Block(s)> Rads> Repeat. So in theory the rads cool the water to ambient before recirculation to the TEC.
And presume condensation is not an issue, as in wrapped in cloth and sealed.
Also presume that the rads are more than capable of cooling the water to ambient.
Imagine if you will, your average PC chassis. Has a nicely spaced 120mm exhaust port on the back next to the rear IO, with plenty of room all around it and possibly even mounting for a 140mm fan. Imagine reverse mounting a downward CPU cooler to it like the CM GeminII or the GeminII S and a decent fan, with the CPU block facing into your chassis. Then imagine placing a low TDP TEC, like 80-250watts, with the hot-side against it, then sandwiching them together with a waterblock on the cold-side. Loop your LCS so that the radiator cooled water passes through this block. Would this be an effective solution to the inefficiency of direct contact with the heat generated by the CPU, by acting as a water chiller instead? Since the expected thermal variance between the hot and cold sides won't exceed 70 degrees, and under this application would likely be getting hit on both sides by ambient temp thermal displacement -air on the hot side and water on the cold side- wouldn't we see the waterblock on it get chilled and thus chill the water flowing through rather well before heading straight to the CPU block? I'm curious if anyone has tried this, or genuinely knows the thermal dynamic properties of this application. Will it work? Has it worked?
Thoughts anyone?
Edit after first two responses:
Okay, I should add to the example as having the following loop sequence:
Res> TEC Block> CPU Block> GPU Block(s)> Rads> Repeat. So in theory the rads cool the water to ambient before recirculation to the TEC.
And presume condensation is not an issue, as in wrapped in cloth and sealed.
Also presume that the rads are more than capable of cooling the water to ambient.
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