AMD details its 3D packaging technology at Hot Chips 33

WYP

News Guru

• Aug 23, 2021

• #1

The future is 3D and AMD is ready!



Read more about AMD's 3D packaging plans.

 

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NeverBackDown

AMD Enthusiast

• Aug 23, 2021

• #2

My mind will be blown once we get actual CPU cores on top of other CPU cores. Just unbelievable and an amazing feat of engineering.

 

looz

Active member

• Aug 23, 2021

• #3

Maybe one day we'll see stacked CPUs with tiny water cooling channels running in between.

 

K

KingNosser

Well-known member

• Aug 23, 2021

• #4

Well cpu's is one thing but ram on top i feel would be really GG for that kind of benifit maybe we'll get smaller boards and thinner laptops, the whole industry will change over time and things like this can help that, but it's just glue right Intel

 

AngryGoldfish

Old N Gold

• Aug 23, 2021

• #5

NeverBackDown said:

My mind will be blown once we get actual CPU cores on top of other CPU cores. Just unbelievable and an amazing feat of engineering.

Click to expand...

That's a bit graphic mate.